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NCSU Scholarly Publications Repository (Search Again)

A growing collection of publications and full text of scholarly works by NC State faculty members, graduate students, and research staff.

Number of Publications: 121
Franzon, Paul D.


Articles
Sarkar, B., Mills, S., Lee, B., Pitts, W. S., Misra, V., & Franzon, P. D. (2018). On using the volatile mem-capacitive effect of TiO2 resistive random access memory to mimic the synaptic forgetting process. Journal of Electronic Materials, 47(2), 994-997.

Zhao, W. X., Gadfort, P., Bhanushali, K., & Franzon, P. D. (2018). RF-only logic: An area efficient logic family for RF-power harvesting applications. IEEE Transactions on Circuits and Systems. I, Regular Papers, 65(1), 406-418.

Yan, Z., Aygun, K., Braunisch, H., & Franzon, P. D. (2016). Multimode high-density link design methodology and implementation. IEEE transactions on Components Packaging and Manufacturing Technology, 6(8), 1251-1260.

Wyers, E. J., Morton, M. A., Sollner, T. C. L. G., Kelley, C. T., & Franzon, P. D. (2016). A generally applicable calibration algorithm for digitally reconfigurable self-healing RFICS. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24(3), 1151-1164.

Burr, G. W., Franzon, P. (2015). Storage class memory. Emerging Nanoelectronic Devices, , 498-510.

Charles, G., & Franzon, P. D. (2015). A multitier study on various stacking topologies of TSV-based PDN systems using on-chip decoupling capacitor models. IEEE transactions on Components Packaging and Manufacturing Technology, 5(4), 541-550.

Chen, X., Zhu, T., Davis, W. R., & Franzon, P. D. (2014). Adaptive and reliable clock distribution design for 3-D integrated circuits. IEEE transactions on Components Packaging and Manufacturing Technology, 4(11), 1862-1870.

Sarkar, B., Ramanan, N., Jayanti, S., Di Spigna, N., Lee, B., Franzon, P., & Misra, V. (2014). Dual floating gate unified memory MOSFET with simultaneous dynamic and non-volatile operation. IEEE Electron Device Letters, 35(1), 48-50.

Gadfort, P., & Franzon, P. D. (2014). Millimeter-scale true 3-D antenna-in-package structures for near-field power transfer. IEEE transactions on Components Packaging and Manufacturing Technology, 4(10), 1574-1581.

Priyadarshi, S., Davis, W. R., Steer, M. B., & Franzon, P. D. (2014). Thermal pathfinding for 3-D ICs. IEEE transactions on Components Packaging and Manufacturing Technology, 4(7), 1159-1168.

Bapat, O. A., Franzon, P. D., & Fastow, R. M. (2014). A generic and scalable architecture for a large acoustic model and large vocabulary speech recognition accelerator using logic on memory. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 22(12), 2701-2712.

Kim, H., Won, C., & Franzon, P. D. (2013). Crosstalk-canceling multimode interconnect using transmitter encoding. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 21(8), 1562-1567.

Wyers, E. J., Steer, M. B., Kelley, C. T., & Franzon, P. D. (2013). A bounded and discretized Nelder-Mead algorithm suitable for RFIC calibration. IEEE Transactions on Circuits and Systems. I, Regular Papers, 60(7), 1787-1799.

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2012). Analog negative-bias-temperature-instability monitoring circuit. IEEE Transactions on Device and Materials Reliability, 12(1), 177-179.

Lou, Y., Yan, Z., Zhang, F., & Franzon, P. D. (2012). Comparing through-silicon-via (TSV) void/pinhole defect self-test methods. Journal of Electronic Testing : Theory and Applications, 28(1), 27-38.

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2012). Comparison of modeling techniques in circuit variability analysis. International Journal of Numerical Modelling, 25(3), 288-302.

Melamed, S., Thorolfsson, T., Harris, T. R., Priyadarshi, S., Franzon, P., Steer, M. B., & Davis, W. R. (2012). Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring. IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems, 31(5), 676-689.

Priyadarshi, S., Saunders, C. S., Kriplani, N. M., Demircioglu, H., Davis, W. R., Franzon, P. D., & Steer, M. B. (2012). Parallel transient simulation of multiphysics circuits using delay-based partitioning. IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems, 31(10), 1522-1535.

Zhu, T., Steer, M. B., & Franzon, P. D. (2012). Surrogate model-based self-calibrated design for process and temperature compensation in analog/RF circuits. IEEE Design & Test of Computers, 29(6), 74-83.

Chakraborti, P., Toprakci, H. A. K., Yang, P., Di Spigna, N., Franzon, P., & Ghosh, T. (2012). A compact dielectric elastomer tubular actuator for refreshable Braille displays. Sensors and Actuators. A, Physical, 179, 151-157.

Harris, T. R., Priyadarshi, S., Melamed, S., Ortega, C., Manohar, R., Dooley, S. R., Kriplani, N. M., Davis, W. R., Franzon, P. D., & Steer, M. B. (2012). A transient electrothermal analysis of three-dimensional integrated circuits. IEEE transactions on Components Packaging and Manufacturing Technology, 2(4), 660-667.

Zhu, T., Steer, M. B., & Franzon, P. D. (2011). Accurate and scalable IO buffer macromodel based on surrogate modeling. IEEE transactions on Components Packaging and Manufacturing Technology, 1(8), 1240-1249.

Schinke, D., Di Spigna, N., Shiveshwarkar, M., & Franzon, P. (2011). Computing with novel floating-gate devices. Computer, 44(2), 29-36.

Thorolfsson, T., Moezzi-Madani, N., & Franzon, P. D. (2011). Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor. IET Computers and Digital Techniques, 5(3), 198-204.

Schinke, D., Priyadarshi, S., Pitts, W. S., Di Spigna, N., & Franzon, P. (2011). SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation. IET Circuits Devices & Systems, 5(6), 477-483.

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2011). Surrogate-model-based analysis of analog circuits-part I: Variability analysis. IEEE Transactions on Device and Materials Reliability, 11(3), 466-473.

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2011). Surrogate-model-based analysis of analog circuits-part II: Reliability analysis. IEEE Transactions on Device and Materials Reliability, 11(3), 458-465.

Zhang, L., Wilson, J. M., Bashirullah, R., Luo, L., Xu, J., & Franzon, P. D. (2009). A 32-Gb/s on-chip bus with driver pre-emphasis signaling. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(9), 1267-1274.

Davis, W. R., Oh, E. C., Sule, A. M., & Franzon, P. D. (2009). Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 17(4), 496-506.

He, T., Corley, D. A., Lu, M., Di Spigna, N. H., He, J. L., Nackashi, D. P., Franzon, P. D., & Tour, J. M. (2009). Controllable molecular modulation of conductivity in silicon-based devices. Journal of the American Chemical Society, 131(29), 10023-10030.

Kumar, P., Reinitz, H. W., Simunovic, J., Sandeep, K. P., & Franzon, P. D. (2009). Overview of RFID technology and Its applications in the food industry. Journal of Food Science, 74(8), R101-R106.

Canavero, F., & Franzon, P. D. (2008). Foreword special section on electrical performance analysis and simulation of interconnects, packages and devices composing electronic systems for high-performance applications. IEEE Transactions on Advanced Packaging, 31(4), 662-663.

He, T., Lu, M., Yao, J., He, J. L., Chen, B., Di Spigna, N. H., Nackashi, D. P., Franzon, P. D., & Tour, J. M. (2008). Reversible modulation of conductance in silicon devices via UV/visible-light irradiation. Advanced Materials, 20(23), 4541-4546.

Xie, Y., Cong, J., & Franzon, P. (2008). Special issue on 3D integrated circuits and microarchitectures. ACM Journal on Emerging Technologies in Computing Systems, 4(4).

Blum, A. S., Soto, C. M., Wilson, C. D., Amsinck, C., Franzon, P., & Ratna, B. R. (2007). Electronic properties of molecular memory circuits on a nanoscale scaffold. IEEE Transactions on Nanobioscience, 6(4), 270-274.

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., LaBennett, R., & Franzon, P. D. (2007). Fully integrated AC coupled interconnect using buried bumps. IEEE Transactions on Advanced Packaging, 30(2), 191-199.

Yuce, M. R., Liu, W. T., Damiano, J., Bharath, B., Franzon, P. D., & Dogan, N. S. (2007). SOI CMOS implementation of a multirate PSK demodulator for space communications. IEEE Transactions on Circuits and Systems. I, Regular Papers, 54(2), 420-431.

Sonkusale, S. R., Di Spigna, N. H., & Franzon, P. D. (2007). Uniformity analysis of wafer scale sub-25 nm wide nanowire array nanoimprint mold fabricated by PEDAL process. Microelectronic Engineering, 84(5-8), 1523-1527.

Zhang, L., Wilson, J. M., Bashirullah, R., Luo, L., Xu, J., & Franzon, P. D. (2007). Voltage-mode driver preemphasis technique for on-chip global buses. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 15(2), 231-236.

He, T., He, J. L., Lu, M., Chen, B., Pang, H., Reus, W. F., Nolte, W. M., Nackashi, D. P., Franzon, P. D., & Tour, J. M. (2006). Controlled modulation of conductance in silicon devices by molecular monolayers. Journal of the American Chemical Society, 128(45), 14537-14541.

Di Spigna, N. H., Nackashi, D. P., Amsinck, C. J., Sonkusale, S. R., & Franzon, P. D. (2006). Deterministic nanowire fanout and interconnect without any critical translational alignment. IEEE Transactions on Nanotechnology, 5(4), 356-361.

Kriplani, N. M., Nackashi, D. P., Amsinck, C. J., Di Spigna, N. H., Steer, M. B., Franzon, P. D., Rick, R. L., Solomon, G. C., & Reimers, J. R. (2006). Physically based molecular device model in a transient circuit simulator. Chemical Physics, 326(1), 188-196.

Varma, A. K., Glaser, A., & Franzon, P. D. (2005). CAD flows for chip-package coverification. IEEE Transactions on Advanced Packaging, 28(1), 96-101.

Davis, W. R., Wilson, J., Mick, S., Xu, M., Hua, H., Mineo, C., Sule, A. M., Steer, M., & Franzon, P. D. (2005). Demystifying 3D ICs: The procs and cons of going vertical. IEEE Design & Test of Computers, 22(6), 498-510.

Sonkusale, S. R., Amsinck, C. J., Nackashi, D. P., Di Spigna, N. H., Barlage, D., Johnson, M., & Franzon, P. D. (2005). Fabrication of wafer scale, aligned sub-25 nm nanowire and nanowire templates using planar edge defined alternate layer process. Physica. E, Low-dimensional Systems & Nanostructures, 28(2), 107-114.

Mehrotra, P., Rao, V., Conte, T. M., & Franzon, P. D. (2005). Optimal chip-package codesign for high-performance DSP. IEEE Transactions on Advanced Packaging, 28(2), 288-297.

Amsinck, C. J., Di Spigna, N. H., Nackashi, D. P., & Franzon, P. D. (2005). Scaling constraints in nanoelectronic random-access memories. Nanotechnology, 16(10), 2251-2260.

Nath, J., Ghosh, D., Maria, J. P., Kingon, A. I., Fathelbab, W., Franzon, P. D., & Steer, M. B. (2005). An electronically tunable microstrip bandpass filter using thin-film barium-strontium-titanate (BST) varactors. IEEE Transactions on Microwave Theory and Techniques, 53(9), 2707-2712.

Blum, A. S., Soto, C. M., Wilson, C. D., Brower, T. L., Pollack, S. K., Schull, T. L., Chatterji, A., Lin, T. W., Johnson, J. E., Amsinck, C., Franzon, P., Shashidhar, R., & Ratna, B. R. (2005). An engineered virus as a scaffold for three-dimensional self-assembly on the nanoscale. Small (Weinheim An Der Bergstrasse, Germany), 1(7), 702-706.

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004). AC coupled interconnect for dense 3-D ICs. IEEE Transactions on Nuclear Science, 51(5), 2156-2160.

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004). Buried bump and AC coupled interconnection technology. IEEE Transactions on Advanced Packaging, 27(1), 121-125.

Mohan, R., Choi, M. J., Mick, S. E., Hart, F. P., Chandrasekar, K., Cangellaris, A. C., Franzon, P. D., & Steer, M. B. (2004). Causal reduced-order modeling of distributed structures in a transient circuit simulator. IEEE Transactions on Microwave Theory and Techniques, 52(9), 2207-2214.

Schaffer, T., Glaser, A., & Franzon, P. D. (2004). Chip-package co-implementation of a triple DES processor. IEEE Transactions on Advanced Packaging, 27(1), 194-202.

Seminario, J. M., Ma, Y. F., Agapito, L. A., Yan, L. M., Araujo, R. A., Bingi, S., Vadlamani, N. S., Chagarlamudi, K., Sudarshan, T. S., Myrick, M. L., Colavita, P. E., Franzon, P. D., Nackashi, D. P., Cheng, L., Yao, Y. X., & Tour, J. M. (2004). Clustering effects on discontinuous gold film NanoCells. Journal of Nanoscience and Nanotechnology, 4(7), 907-917.

Scheffler, M., Franzon, P. D., & Troster, G. (2004). A defect level versus cost system tradeoff for electronics manufacturing. IEEE Transactions on Electronics Packaging Manufacturing, 27(1), 67-76.

Palmer, J. A., Dessent, B., Mulling, J. F., Usher, T., Grant, E., Eischen, J. W., Kingon, A. I., & Franzon, P. D. (2004). The design and characterization of a novel piezoelectric transducer-based linear motor. IEEE/ASME Transactions on Mechatronics, 9(2), 392-398.

Stan, M. R., Franzon, P. D., Goldstein, S. C., Lach, J. C., & Ziegler, M. M. (2003). Molecular electronics: From devices and interconnect to circuits and architecture. Proceedings of the IEEE, 91(11), 1940-1957.

Tour, J. M., Cheng, L., Nackashi, D. P., Yao, Y. X., Flatt, A. K., St Angelo, S. K., Mallouk, T. E., & Franzon, P. D. (2003). NanoCell electronic memories. Journal of the American Chemical Society, 125(43), 13279-13283.

Tour, J. M., Van Zandt, W. L., Husband, C. P., Husband, S. M., Wilson, L. S., Franzon, P. D., & Nackashi, D. P. (2002). Nanocell logic gates for molecular computing. IEEE Transactions on Nanotechnology, 1(2), 100-109.

Mulling, J., Usher, T., Dessent, B., Palmer, J., Franzon, P., Grant, E., & Kingon, A. (2001). Load characterization of high displacement piezoelectric actuators with various end conditions. Sensors and Actuators. A, Physical, 94(1-2), 19-24.

Gahide, S., Seyam, A., Hodge, G., Oxenham, W., & Franzon, P. (2000). Micromachines and textiles: Matching two industries. Textile Asia, 31, 58-66.

Lo, H. L., Kauffman, J. F., & Franzon, P. D. (1999). High frequency loss and electromagnetic field distribution for striplines and microstrips. IEEE Transactions on Advanced Packaging, 22(1), 16-25.

Al-Sarawi, S. F., Abbott, D., & Franzon, P. D. (1998). A review of 3-D packaging technology. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, 21(1), 2-14.

Hsieh, H. Y., Liu, W. T., Franzon, P. D., & Cavin, R. (1997). Clocking optimization and distribution in digital systems with scheduled skews. Journal of VLSI Signal Processing Systems for Signal Image and Video Technology, 16(2-3), 131-147.

Books
Smith, D. R., & Franzon, P. D. (2000). Verilog styles for synthesis of digital systems. Upper Saddle River, NJ: Prentice Hall.

Conference Papers
Srinivasan, V., Chowdhury, R. B. R., Forbes, E., Widialaksono, R., Zhang, Z. Q., Schabel, J., Ku, S., Lipa, S., Rotenberg, E., Davis, W. R., & Franzon, P. D. (2017). H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor. In 2017 ieee 35th international conference on computer design (iccd). (IEEE International Conference on Computer Design, ) (pp. 145-152).

Wyers, E. J., Qi, W. Y., & Franzon, P. D. (2017). A Robust calibration and supervised machine learning reliability framework for digitally-assisted self-healing RFICS. In 2017 ieee 60th international midwest symposium on circuits and systems (mwscas). (Midwest Symposium on Circuits and Systems Conference Proceedings, ) (pp. 1138-1141).

Dey, S., & Franzon, P. D. (2016). Design and ASIC acceleration of cortical algorithm for text recognition. (2016 29th IEEE International System-on-Chip Conference (SOCC), ) (pp. 114-119).

Dey, S., & Franzon, P. D. (2016). Design and ASIC acceleration of cortical algorithm for text recognition. (2016 29th IEEE International System-on-Chip Conference (SOCC), ) (pp. 114-119).

Li, W. F., & Franzon, P. (2016). Hardware implementation of hierarchical temporal memory algorithm. (2016 29th IEEE International System-on-Chip Conference (SOCC), ) (pp. 133-138).

Li, W. F., & Franzon, P. (2016). Hardware implementation of hierarchical temporal memory algorithm. (2016 29th IEEE International System-on-Chip Conference (SOCC), ) (pp. 133-138).

Li, B. W., & Franzon, P. D. (2016). Machine learning in physical design. In Ieee conference on electrical performance of electronic packaging and. (Systems-EPEPS, ) (pp. 147-149).

Schabel, J., Baker, L., Dey, S., Li, W. F., & Franzon, P. D. (2016). Processor-in-memory support for artificial neural networks. (2016 IEEE International Conference on Rebooting Computing (icrc), ).

Nigussie, T., & Franzon, P. D. (2016). RDL and interposer design for DiRAM4 interfaces. In Ieee conference on electrical performance of electronic packaging and. (Systems-EPEPS, ) (pp. 17-19).

Harris, T. R., Pavlidis, G., Wyers, E. J., Newberry, D. M., Graham, S., Franzon, P., & Davis, W. R. (2016). Thermal raman and IR measurement of heterogeneous integration stacks. In Intersociety conference on thermal and thermomechanical phenomena in. (Electronic Systems, ) (pp. 1505-1510).

Priyadarshi, S., Davis, W. R., & Franzon, P. D. (2014). Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC. (2014 IEEE International Conference on IC Design & Technology (ICICDT), ).

Yan, Z., Franzon, P. D., Aygun, K., & Braunisch, H. (2013). Circuit/channel co-design methodology for multimode signaling. (2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), ) (pp. 1356-1361).

Suh, E. J., & Franzon, P. D. (2013). Design of 60 GHz contact less probe system for RDL in passive silicon interposer. In 2013 ieee international 3d systems integration conference (3dic). (IEEE International 3d Systems Integration Conference, ).

Tshibangu, N. M., Franzon, P. D., Rotenberg, E., & Davis, W. R. (2013). Design of controller for L2 cache mapped in Tezzaron stacked DRAM. In 2013 ieee international 3d systems integration conference (3dic). (IEEE International 3d Systems Integration Conference, ).

Franzon, P. D., Priyadarshi, S., Lipa, S., Davis, W. R., & Thorolfsson, T. (2013). Exploring early design tradeoffs in 3DIC. In 2013 ieee international symposium on circuits and systems (iscas). (IEEE International Symposium on Circuits and Systems, ) (pp. 545-549).

Zhang, Z. Q., Noia, B., Chakrabarty, K., & Franzon, P. (2013). Face-to-face bus design with built-in self-test in 3D ICS. In 2013 ieee international 3d systems integration conference (3dic). (IEEE International 3d Systems Integration Conference, ).

Priyadarshi, S., Choudhary, N., Dwiel, B., Upreti, A., Rotenberg, E., Davis, R., & Franzon, P. (2013). Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors. In Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013). (International Symposium on Quality Electronic Design, ) (pp. 1-7).

Sarkar, B., Jayanti, S., Di Spigna, N., Lee, B., Misra, V., & Franzon, P. (2013). Investigation of intermediate dielectric for dual floating gate MOSFET. (2013 13th Non-Volatile Memory Technology Symposium (NVMTS), ).

Franzon, P. D. (2013). MOOCs, OOCs, flips and hybrids: The new world of higher education. In Proceedings ieee international conference on microelectronic systems. (Education, ) (pp. 13-13).

Karim, M. A., Franzon, P. D., & Kumar, A. (2013). Power comparison of 2D, 3D and 2.5D interconnect solutions and power optimization of interposer interconnects. (2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), ) (pp. 860-866).

Zhang, Z. Q., & Franzon, P. (2013). TSV-based, modular and collision detectable face-to-back shared bus design. In 2013 ieee international 3d systems integration conference (3dic). (IEEE International 3d Systems Integration Conference, ).

Franzon, P., & Bar-Cohen, A. (2013). Thermal requirements in future 3d processors. In 2013 ieee international 3d systems integration conference (3dic). (IEEE International 3d Systems Integration Conference, ).

Zhu, T., Yelten, M. B., Steer, M. B., & Franzon, P. D. (2013). Variation-aware circuit macromodeling and design based on surrogate models. In Simulation and modeling methodologies, technologies and applications. (Advances in Intelligent Systems and Computing, 197) (pp. 255-269).

Zhao, W. X., Gadfort, P., Erickson, E., & Franzon, P. D. (2013). A compact inductively coupled connector for mobile devices. (2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), ) (pp. 2385-2390).

Thorolfsson, T., Lipa, S., & Franzon, P. D. (2012). A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration. In 2012 ieee custom integrated circuits conference (cicc). (IEEE Custom Integrated Circuits Conference, ).

Charles, G., & Franzon, P. D. (2012). Comparison of TSV-based PDN-design effects using various stacking topology methods. In Ieee conference on electrical performance of electronic packaging and. (Systems-EPEPS, ) (pp. 83-86).

Gadfort, P., & Franzon, P. D. (2012). Design, modeling, and fabrication of mm(3) three-dimensional integrated antennas. (2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), ) (pp. 1794-1799).

Gadfort, P., & Franzon, P. D. (2012). Near threshold RF-only analog to digital converter. (2012 IEEE subthreshold microelectronics conference (SUBVT), ).

Yelten, M. B., Franzon, P. D., & Steer, M. B. (2012). Process mismatch analysis based on reduced-order models. In 2012 13th international symposium on quality electronic design (isqed). (International Symposium on Quality Electronic Design, ) (pp. 648-655).

Yan, Z., Won, C. Y., Franzon, P. D., Aygun, K., & Braunisch, H. (2012). S-parameter based multimode signaling. In Ieee conference on electrical performance of electronic packaging and. (Systems-EPEPS, ) (pp. 11-14).

Ledford, J., Gadfort, P., & Franzon, P. D. (2012). An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies. (2012 IEEE subthreshold microelectronics conference (SUBVT), ).

Franzon, P. D., Davis, W. R., Thorolfsson, T., & Melamed, S. (2011). 3D specific systems: Design and CAD. In 2011 20th asian test symposium (ats). (Asian Test Symposium Proceedings, ) (pp. 470-473).

Chen, X., Davis, W. R., & Franzon, P. D. (2011). Adaptive clock distribution for 3D integrated circuits. In Ieee conference on electrical performance of electronic packaging and. (Systems-EPEPS, ) (pp. 91-94).

Charles, G., Franzon, P. D., Kim, J., & Levin, A. (2011). Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC. In Ieee conference on electrical performance of electronic packaging and. (Systems-EPEPS, ) (pp. 267-270).

Choi, Y. J., Braunisch, H., Aygun, K., & Franzon, P. D. (2010). Multimode transceiver for high-density interconnects: Measurement and validation. In 2010 proceedings 60th electronic components and technology conference (ectc). (Electronic Components and Technology Conference, ) (pp. 1733-1738).

Di Spigna, N., Chakraborti, P., Winick, D., Yang, P., Ghosh, T., & Franzon, P. (2010). The integration of novel EAP-based Braille cells for use in a refreshable tactile display. In Electroactive polymer actuators and devices (eapad) 2010. (Proceedings of SPIE-the International Society for Optical Engineering, 7642).

Zhu, T., & Franzon, P. D. (2009). Application of surrogate modeling to generate compact and PVT-sensitive IBIS models. (Electrical Performance of Electronic Packaging and Systems, ) (pp. 77-80).

Thorolfsson, T., Melamed, S., Charles, G., & Franzon, P. D. (2009). Comparative analysis of two 3D integration implementations of a SAR processor. (2009 IEEE International Conference on 3d Systems Integration, ) (pp. 25-28).

Melamed, S., Thorolfsson, T., Srinivasan, A., Cheng, E., Franzon, P., & Davis, R. (2009). Junction-level thermal extraction and simulation of 3DICs. (2009 IEEE International Conference on 3d Systems Integration, ) (pp. 395-401).

Gadfort, P., & Franzon, P. D. (2009). Low-power self-equalizing driver for silicon carrier interconnects with low bit error rate. (Electrical Performance of Electronic Packaging and Systems, ) (pp. 37-40).

Erickson, E., Wilson, J., Chandrasekar, K., & Franzon, P. D. (2009). Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors. (Electrical Performance of Electronic Packaging and Systems, ) (pp. 121-124).

Oh, E. C., & Franzon, P. D. (2009). Technology impact analysis for 3D TCAM. (2009 IEEE International Conference on 3d Systems Integration, ) (pp. 206-210).

Tsai, M. L., Klooz, A., Leonard, A., Appel, J., & Franzon, P. (2009). Through silicon Via(TSV) defect/pinhole self test circuit for 3D-IC. (2009 IEEE International Conference on 3d Systems Integration, ) (pp. 170-177).

Zhu, T., & Franzon, P. D. (2009). An enhanced macromodeling approach for differential output drivers. (BMAS 2009: Proceedings of the 2009 IEEE International Behavioral Modeling and Simulation Workshop, ) (pp. 54-59).

Thorolfsson, T., Moezzi-Madani, N., & Franzon, P. D. (2009). A low power 3D integrated FFT engine using hypercube memory division. (ISLPED 09, ) (pp. 231-236).

Varma, A. K., Steer, M., & Franzon, P. D. (2008). Improving behavioral IO buffer modeling based on IBIS. (IEEE Transactions on Advanced Packaging, 31 4) (pp. 711-721).

Chandrasekar, K., Wilson, J., Erickson, E., Feng, Z. P., Xu, J., Mick, S., & Franzon, P. (2008). Inductively coupled connectors and sockets for multi-Gb/s pulse signaling. (IEEE Transactions on Advanced Packaging, 31 4) (pp. 749-758).

Nath, J., Ghosh, D., Fathelbab, W., Maria, J.-P., Kingon, A. I., Franzon, P. D., & Steer, M. B. (2005). A tunable combline bandpass filter using thin film barium strontium titanate interdigital varactors on an alumina substrate. In Proceedings of the IEEE MTT-S International Microwave Symposium, June 12-17, 2005, Long Beach, CA. (pp. 595-598). Piscataway, NJ: IEEE.

Nath, J., Ghosh, D., Fathelbab, W., Maria, J.-P., Kingon, A. I., Franzon, P. D., & Steer, M. B. (2004). A tunable combline bandpass filter using thin film barium strontium titanate (BST). In Proceedings of the 2004 Asia Pacific Microwave Conference, New Delhi. (pp. 939-940). Piscataway, NJ: IEEE.

Gahide, S., Hodge, G., Seyam, A., Oxenham, W., & Franzon, P. (2001). Smart sensors to monitor warp tension and breaks on a loom.

Gahide, S., Seyam, A., Hodge, G., Oxenham, W., & Franzon, P. (2000). Application of micromachines to textiles: Using smart sensors to monitor warp tension and breaks during formation of woven fabrics. In Proceedings of the International Mechanical Engineering Congress & Exposition, ASME, Orlando (FL), November 2000. New York: ASME.

Gahide, S., Hodge, G., Oxenham, W., Seyam, A. M., & Franzon, P. D. (2000). Micromachines and textiles: Matching two industries. In Manchester 2000 CD-ROM: Papers from the 2000 Annual (80th) World Conference of The Textile Institute. April 16-19, 2000.

Patents
Mehrotra, P., & Franzon, P. D. (2006). Methods and systems for fast packet forwarding. U.S. Patent No. 6,985,483. Washington, DC: U.S. Patent and Trademark Office.

Franzon, P. D., Mick, S. E., & Wilson, J. M. (2005). Buried solder bumps for AC-coupled microelectronic interconnects. U.S. Patent No. 6,927,490. Washington, DC: U.S. Patent and Trademark Office.

Franzon, P. D., Mick, S. E., & Wilson, J. M. (2005). Inductively coupled electrical connectors. U.S. Patent No. 6,885,090. Washington, DC: U.S. Patent and Trademark Office.

Mehrotra, P., & Franzon, P. D. (2005). Methods and systems for fast binary network address lookups using parent node information stored in routing table entries. U.S. Patent No. 6,934,252. Washington, DC: U.S. Patent and Trademark Office.


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