High performance integrated circuit chip package
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Date
1994
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Turlik, I., Reisman, A., Nayak, D., Hwang, L., Dishon, G., Jacobs, S., Darveaux, R., Poley, & Neil, M. (1994). High performance integrated circuit chip package. U.S. Patent No. 5,325,265. Washington, DC: U.S. Patent and Trademark Office.
